Electroless copper plating refers to a process in which copper layers are deposited on the surface of a material without the need for an electric current. This method is usually based on a chemical reduction reaction in which copper ions are deposited on the surface of the substrate in a suspension by the action of a chemical reducing agent. So, what does the maintenance of electroless copper plating process include?
In the previous series of articles, we mentioned that when using electroless nickel plating solution for production, Ndfeb roller plating needs to use a small barrel, so what are the precautions when it comes to actual operation?
Maybe you think that when using acid tin plating brighteners, as long as you control the process parameters well, it is enough to get a good quality of plating, and it is actually true to think so! It is just that 80% of platers also find that soon after production, the shine of the plated layer starts to deteriorate and solderability is seriously reduced? The reason for such problems is that your plating solution has become cloudy.
Direct potassium galvanizing after activation The composition and process conditions of galvanizing solution are the same as those of galvanizing solution for commonly used iron and steel workpieces, and it can be used with Bigely potassium salt galvanizing process BZ-528, which is divided into two kinds of softening agent and brightening agent, and it can be added according to the proportion of the product specification in the production.
The electroless nickel process for aluminum alloys provides a uniform coating that increases corrosion resistance and hardness. However, the characteristics of the aluminum alloy surface may result in poor bonding between the nickel coating and the aluminum alloy substrate. Poor bonding can be caused by several reasons:
Alkaline electrozinc plating process and acid electrozinc plating process are two common zinc plating methods for metal surface treatment, which differ in terms of the nature of the plating solution, the characteristics of the plated layer, the productivity and the environmental impact.
