During the application of acid galvanizing brightener, it is important to maintain and regulate the pH value in the plating solution.
Some customers have asked what to do if the solderability of the plated layer is unstable when we use acid tin plating brightener. In order to answer this question, we need to know what are the causes of this kind of failure?
There are a lot of factors to get high brightness and high leveling plating, the selection of good brightener and correct application is certainly an important factor, but not the only factor. Some plating plant, a problem will be considered to be the cause of nickel plating brightener, is it really so? In fact, it is not.
In the fierce market competition, one of the main challenges facing customers of electroplating plants is how to improve production efficiency and coating quality. Especially in the spark plug electroless nickel plating process, the deposition rate of some manufacturers' middle phosphorus electroless nickel plating solution is slow, which undoubtedly increases the production cycle and cost, resulting in a decline in market competitiveness. So, how to improve the speed of electroless nickel plating without sacrificing the quality of the coating?
In practice in many plating plants, it is a major challenge to ensure the brightness and thickness consistency of the plated layer on the surface of the workpiece. Especially when using homemade electroless nickel plating solution, we often encounter the problem of uneven plating layer and surface brightness. This not only affects the quality of the final product, but also increases the cost of repeated redoing. So, is there a better solution? The medium phosphorus electroless nickel plating solution Ni-809 launched by Bigely Technology can solve these problems.
Copper pyrophosphate plating process is widely used in practical production due to the advantages of simple composition of plating solution, weak alkali and good stability. However, when using copper pyrophosphate brightener, the production efficiency is affected by the narrow range of working current density. How to improve the plating efficiency of copper pyrophosphate plating process? It is a difficult point that many electroplating factories are struggling to find.
