Recently, When using nickel plating additive, Mr. Qin found that the thickness of nickel plating layer of the plated workpiece was 5μm. When riveting, the nickel layer will crack, which seriously affects the performance of the workpiece.However, Mr. Qin checked the production processes, concentration of plating solution components and operating parameters, which were normal.What is the problem?
Recently, Mr. Weng found that the brightness of the workpiece coating was poor during the process of using the tin plating additive, and there was color fading during placement, which would increase the resistance of the coating and affect the performance of the workpiece.So Mr. Weng wants to find a tin plating additive with good brightness and no fading.
Mr. Fang received a connector for aircraft, and the workpiece coating needs 20 μm thickness.However, after electroless nickel plating on the workpiece, the coating is brittle and magnetic, which does not meet the customer's requirements.The additive supplier still has such problems after treating the bath for many times, so Mr. Fang wants to find a high phosphorus electroless nickel plating additive that meets the customer's requirements.
Mr. Xiong found that the dispersion of the workpiece coating was relatively poor when using tin plating additives. The tin coating in the low current area was thin, which affected the weldability of the workpiece.So Mr. Xiong wants to find a good dispersion of methanesulfonic acid tin plating additive.
Mr. Xu of Tianjin has opened a new production line of methanesulfonic acid type tin plating, which is ready for precise electronic product tin plating processing and production.According to a friend, Mr. Xu used a tin plating brightener, and the workpiece coating was prone to appear blue and yellow, which seriously affected the performance and service life of the workpiece.So Mr. Xu wants to find a better performance methanesulfonic acid tin plating brightener.
Due to production needs, Mr. Chen thinks that the plating speed of his electroless copper plating solution is slow, only 2-3 μm/hour, seriously affecting the production progress.So Mr. Chen wants to find a electroless copper plating additive with fast deposition speed.