Semi-bright nickel process and bright nickel plating process are two different plating technologies. Although both involve plating a layer of nickel on the surface of the substrate, they have obvious differences in practical application, mainly in terms of gloss, process parameters, usage and performance. The following is a detailed comparison and description of the two:
Pyrophosphate copper plating process is a common plating method, which is widely used in electronics, aerospace and other fields. In copper plating process, the bonding strength of the coating is crucial, which determines the quality and durability of the coating.PH value is one of the key parameters affecting the bonding strength of copper pyrophosphate plating.
Some customers inquired what are the methods of analyzing the acid bright copper plating solution? In this article, we will discuss the analytical methods of copper sulfate, hoping to share some ideas for plating plants.
Electrolytic degreasing technology has been widely used in electroplating, metal processing and other fields. In this paper, we will introduce the basic principle of electrolytic degreasing and its role in ensuring the quality of plating layer to help readers better understand the importance and application value of this technology.
In the process of using zinc-nickel alloy natural color passivator, when there is a problem with the passivation film, such as blue passivation film, is this caused by the bad use of passivator? Actually, it's not. Maybe it's the bath.
Alkaline zinc-nickel alloy plating is a widely used corrosion protection technology in industry, especially important in working conditions where high corrosion resistance is required. In this paper, we will discuss the effect of nickel content on corrosion resistance in this process and recommend the use of Bigely BZ-617 alkaline zinc-nickel alloy additive to improve the quality of the plated layer.
