The process is a sulfamate nickel plating process Ni-1000, the semi-bright nickel plating layer has low stress and good ductility. It is very suitable as the bottom layer of precious metals and ordinary metal layers, and is widely used in high requirements such as printed circuit boards, semiconductors, and connectors. The field of electronic component manufacturing.
The process is amino sulfonic acid type nickel plating process. The semi-bright nickel coating has low stress and good ductility.
Ni-3000 is an additive specially formulated for the process of continuous electroplating, after plating pure (bright/mist) tin on the nickel sulfamate bottom layer. This additive can make the plated workpiece pass the high temperature reflow test (IR, reflow) without discoloration on the surface of the coating.
Ni-3000 is a specially prepared additive for continuous plating of sulfonated nickel on the substrate followed by pure (bright/mist) tin. This additive allows the plated workpiece to pass a high temperature reflux test (IR, reflux) without discoloration of the coating surface
