We all know that in the production process of using electroless nickel plating solution, the performance of the plating solution and the deposition rate of the coating will gradually decrease.
We all know that the key drawback of plastic electroplating and various non-metallic electroplating is the activation of colloidal palladium.
When we use Sulfamic acid nickel additive in the production process, when the crystallization of the coating changes, a certain internal stress will be generated.
A customer inquired that during the production process of using sulfate tin plating brightener, the solderability of the workpiece tin coating is unstable, leading to the phenomenon of some workpiece coatings falling off easily after high-temperature treatment.
Many customers are sensitive to the price of acid copper brighteners and want to purchase products that are affordable and cost-effective. They often purchase acid copper brighteners that are cheap and have poor performance.
Many customers choose cheaper colloidal palladium activators in the production process of plastic electroplating. Little did they know that cheap activators not only have low concentration, poor activity, large dosage, but also high production costs. So, choosing high concentration colloidal palladium activators can save production costs!
