Metal impurities in the tin plating solution such as copper ions and iron ions can interfere with the tin plating process. These impurity metals can be co-deposited during the plating process, resulting in an impure composition of the plated layer, which in turn affects the physical and chemical properties of the plated layer. Therefore, it is necessary to know how to remove impurities from tin plating solution.
In the electroplating industry, the dispersing ability of the plating solution is a key factor that affects the uniformity and quality of the plated layer on the substrate. Additives in the nickel sulfamate plating process play a vital role in regulating this property.
In recent years, with the rapid development of new energy vehicles, electroplating technology plays a key role in ensuring the performance of auto parts and reducing manufacturing costs. Zinc-nickel alloy plating process has become a popular choice in the new energy vehicle industry due to its good corrosion resistance and mechanical strength. Among them, Bigely BZ-617 alkaline zinc-nickel alloy brightener has attracted much attention because of its own properties.
When you are doing the production of electroless nickel plating, you must face a big problem: poor stability of the plating solution, slow deposition, resulting in low productivity and high production costs. What should be done?
Alkaline zincate galvanizing process is a common electroplating process used to coat metal surfaces with zinc to provide a corrosion-resistant protective coating. In the alkaline zincate galvanizing process, sodium carbonate is usually added to the alkaline zincate galvanizing process and it serves several purposes:
Nickel sulfamate plating is a widely used plating process in industrial production, where the core objective is to obtain nickel coatings with high bonding strength and excellent physicochemical properties. In practice, the use of additives has a significant impact on the bonding strength of the plated layer. In this issue, we take a closer look at this issue.
