The deposition rate of the copper pyrophosphate plating process depends on a number of factors, including the composition of the bath, operating current density, temperature and agitation conditions. In general, when properly operated, copper pyrophosphate plating can achieve relatively fast deposition rates to ensure productivity.
Sulfamate nickel additive is a chemical used in nickel plating process. As an electroplating additive, nickel sulfamate plays a lot of positive roles in improving the quality of nickel plating layer. The following are some possible benefits of using nickel sulfamate additive in electroplating process:
If you want to increase the salt spray test performance of electroless nickel plating layer, it means to improve the corrosion resistance of the coating in simulated Marine or salt corrosion environment. Typically, a salt spray test is an accelerated test used to assess the corrosion resistance of a material, and the coating is subjected to a high concentration of salt water mist over a period of time. In order to improve the performance of electroless nickel plating in salt spray testing, the following measures can be taken:
In the zinc electroplating process, many electroplating plants feedback in the production process of the coating surface white spots, there are many reasons for such failures, only from the source, in order to solve the problem. In this article, we will take a look at the relevant reasons.
If the electroless nickel plating solution is unstable, it often causes problems such as poor coating quality and decreased corrosion resistance, so we need to strictly control the stability of the plating solution, then what are the reasons for the poor stability of the plating solution?