What are the factors affecting the plating solution stability of electroless copper plating solution?

What are the factors affecting the plating solution stability of electroless copper plating solution?

Fri Nov 22 16:21:45 CST 2024

Plating solution stability of electroless copper plating solution is the key factor to ensure the quality and uniformity of the plated layer. Plating solution stability not only affects the appearance and performance of the plated layer, but also directly related to production efficiency and cost control. Below, we will discuss how what factors affect the stability of electroless copper plating solution.

Factors affecting the stability of plating solution

pH: The pH of the plating solution is an important factor affecting the stability of the plating solution. Too high or too low pH value of the plating solution may lead to decomposition of the plating solution and reduce the stability. Usually, the pH value of electroless copper plating solution is controlled between 11.5-12.5, which can ensure faster plating speed and avoid the decomposition of plating solution. However, when the pH value exceeds 13, the reaction rate will be too fast and the bath will decompose easily.

Concentration balance: The concentrations of metal salts, reducing agents and additives must be maintained at the proper level; incorrect ratios may result in defective plating or failure to deposit properly. Concentration imbalance not only affects the quality of the coating, but also reduces the stability of the bath.

Temperature: Temperature is the key factor affecting the reaction rate of electroless copper plating solution. Too high or too low temperature may affect the stability of the plating solution, resulting in a decline in the quality of the coating.

Additives: The use of additives has an impact on the stability of the plating solution. Bigely electroless copper plating solution HS-ECu-801 improves the stability of the plating solution by optimizing the formulation of complexing agents and stabilizers. Suitable complexing agents help to equalize the release and deposition of copper ions and avoid localized over deposition, thus improving the brightness of the plated layer and the stability of the plating solution.

About us

Guangdong Bigely Technology Co., Ltd. ,founded in 2003, is a high-tech enterprise integrating R & D,production, sales and service, specializing in the production of electroplating additives. As a famous electroplating additives source manufacturer in China, Bigely has over 20 years' experience in electroplating additives production and own production base of 5000 square meters. We can produce 15,000 tons of electroplating additives every year, which can fully meet the needs of customers.

Our products have passed ISO9001, ISO14001, OHSAS18001 management system certification and the test of Swiss SGS company and we also possess 2 national invention patents and 6 utility model patents.

If you need our high-quality electroplating additives, please contact us. We can provide you samples to you for test, and also provide a series of services.