In the electroplating industry, the application of acid copper brightener is important, which directly affects the quality and performance of the plated layer. Acid copper brighteners contain a variety of organic compounds and additives that play an important role in the electrodeposition of copper.
Aluminum alloy workpiece must be immersed in transition metal plating, such as immersion zinc, tin, nickel metal, in order to obtain a good combination of plating, most of the current applications in mass production to sink zinc for more than the secondary zinc process is dominant, the sinking of zinc water is generally by the market, with each accounted for half of the market. The maintenance and management of the zinc precipitation agent need to pay attention to the following points:
Electroplating is a physico-chemical process that utilizes electrolysis to form a uniform, dense, and well-adhered coating on metals, alloys, or other conductive materials. During the plating process, the cleanliness of the surface of the workpiece is directly related to the quality of the plating. Especially, electroplating degreasing process is one of the key steps to ensure the quality of electroplating.
In the process of using zinc-nickel alloy natural color passivator, when there is a problem with the passivation film, such as blue passivation film, is this caused by the problem of passivator? Actually, it's not. Maybe it's the plating solution.
Mr. Tu from Wenzhou, Zhejiang Province is the owner of a processing plant that processes plastic plating and multi-layer nickel plating. Recently, Mr. Tu found that the palladium activation working solution he used in the production process would produce more hydrochloric acid fog. Considering that the acid fog would pollute the environment and harm human beings, Mr. Tu wanted to find a colloidal palladium water without acid fog.
Reducing agent plays a central role in the electroless copper plating solution, and its selection and use have a significant impact on the quality of the copper chemical coating, deposition rate, and the stability and efficiency of the entire electroless copper plating process.
