The use of Cu-510, a dye-based acid copper brightener, is not only widespread but also of particular importance in the electroplating process. Cu-510 is an important additive to improve the quality of copper sulfate plating. In the following, we will introduce the mechanism of action of Bigely Cu-510 dye-based acid copper brightener and its advantages in electroplating production.
We know that in the copper-nickel-chromium plating process, there are often a variety of failures, in which the poor bonding of the plated layer is a plater often encountered, then, this issue of the article we will discuss the use of alloy chemical degreasing powder, what are the things need to pay attention to, so as to ensure that the bonding of the plated layer is good.
Electroplating is a physico-chemical process that utilizes electrolysis to form a uniform, dense, and well-adhered coating on metals, alloys, or other conductive materials. During the plating process, the cleanliness of the surface of the workpiece is directly related to the quality of the plating. Especially, electroplating degreasing process is one of the key steps to ensure the quality of electroplating.
Electroless nickel plating is a common and important process, which aims to provide the surface of products with wear-resistant, corrosion-resistant and aesthetic properties. However, in practice, we often encounter the problem of discoloration of the appearance of the plated layer, especially the water stains formed during the drying process after washing, which is the main cause of the poor appearance of the plated layer. To solve this problem, Bigely plating dewatering agent BC-13 can ensure the bright and beautiful appearance of the plated layer.
In the process of using zinc-nickel alloy natural color passivator, when there is a problem with the passivation film, such as blue passivation film, is this caused by the problem of passivator? Actually, it's not. Maybe it's the plating solution.
In the previous article we mentioned two factors affecting the alignment in the low area in zinc-nickel alloy plating process, respectively, sodium hydroxide and zinc concentration, which is analyzed from the point of view of the concentration of the main salt of the plating solution, in fact, there is another factor that affects the low zone of the alignment factor, that is, the concentration of the complexing agent.
