In the field of metal surface treatment, nickel plating is a commonly used process, which can provide corrosion resistance, wear resistance, decorative effect and improve the electrical conductivity of the metal. According to the deposition method of nickel coating, it can be divided into two kinds: electroless nickel plating process and electroplating nickel process. In this article, we will discuss the differences between electroless nickel plating and electroplating nickel and the characteristics of their respective coating binding forces.
When we use electroless copper plating solution, if there are solid catalytic particles in the plating solution, it will affect the deposition of the coating, therefore, we need to understand the causes, so as to avoid such phenomena.
Electroless copper plating (also known as autocatalytic copper plating) is a process that deposits a thin layer of copper on a conductive or non-conductive surface without the need for an applied current. Although the electroless copper plating process has many advantages, which we have talked about in previous articles, there are also a variety of defects that can occur during the production process, affecting the quality and performance of the coating. Today we will talk about why these failures are caused.