The tin plating additives used in the sulfate matte tin plating process have a direct impact on the quality of the plated layer, and the plated layer scratching is often related to the use and regulation of these additives. The type of additives, their concentration and their ratio in the plating solution will affect the final quality of the plated layer.
In acid tin plating process, the plating solution turbidity not only affects the product appearance, but also may bring quality problems. Don't worry, we can teach you a few tricks, so that your plating solution as clear as ever!
Some customers inquired that during the production process using semi-bright nickel additives, the bonding of the plating layer is poor, resulting in the semi-bright nickel plating layer coming off easily, what is the reason for this?
Localized blistering of the plating is a common quality problem in the production of barrel nickel plating of iron parts, and the following are some of the common causes that may lead to such failures:
The use of Cu-510, a dye-based acid copper brightener, is not only widespread but also of particular importance in the electroplating process. Cu-510 is an important additive to improve the quality of copper sulfate plating. In the following, we will introduce the mechanism of action of Bigely Cu-510 dye-based acid copper brightener and its advantages in electroplating production.
We know that in the copper-nickel-chromium plating process, there are often a variety of failures, in which the poor bonding of the plated layer is a plater often encountered, then, this issue of the article we will discuss the use of alloy chemical degreasing powder, what are the things need to pay attention to, so as to ensure that the bonding of the plated layer is good.
