In acid tin plating process, the plating solution turbidity not only affects the product appearance, but also may bring quality problems. Don't worry, we will teach you a few tricks, so that your plating solution as clear as ever!
In the chromium plating process, the size of the current is one of the most important parameters in determining the quality of the plated layer. The size of the current affects the deposition rate, deposition uniformity, gloss, hardness and adhesion of the coating in many ways.
Hard chrome brighteners are primarily used to improve the quality of the plated layer and include a range of organic compounds such as sulfates, fluorides, chromates and different types of organic additives that can affect various aspects of the hard chrome plating process, including deposition rates:
Some customers inquired that during the production process using semi-bright nickel additives, the bonding of the plating layer is poor, resulting in the semi-bright nickel plating layer coming off easily, what is the reason for this?
Localized blistering of the plating is a common quality problem in the production of barrel nickel plating of iron parts, and the following are some of the common causes that may lead to such failures:
In the electroplating industry, the application of acid copper brightener is important, which directly affects the quality and performance of the plated layer. Acid copper brighteners contain a variety of organic compounds and additives that play an important role in the electrodeposition of copper.