Pyrophosphate copper plating process is a common plating method, which is widely used in electronics, aerospace and other fields. In copper plating process, the bonding strength of the coating is crucial, which determines the quality and durability of the coating.PH value is one of the key parameters affecting the bonding strength of copper pyrophosphate plating.
The change of PH value will directly affect the ion concentration in the plating solution and the process of electrochemical reaction, thus affecting the bonding force of the plating layer. When the PH value of pyrophosphate copper plating solution is too low, the higher concentration of hydrogen ions in the solution will lead to the accelerated reduction of copper ions, resulting in copper plating layer with fine grains and greater internal stress, which will easily lead to a decline in the bonding force. On the contrary, when the PH value is too high, the concentration of hydroxide ions in the plating solution increases, which is easy to form copper hydroxide precipitation, affecting the denseness and uniformity of the plating layer, and ultimately leading to weakening of the bonding force of the plating layer.
Controlling the proper pH value is very important to improve the bonding of copper pyrophosphate plated coatings. Usually, the suitable pH value for pyrophosphate copper plating process ranges from 8.0 to 9.0. In this range, the plating solution can maintain a stable chemical environment, the reduction rate of copper ions is moderate, and the resulting copper plating layer has moderate and dense grains, which ensures a good bonding.
During the actual plating process, the plating industry often needs to select a brightener with superior performance to further improve the quality of the plated layer. One such product is Bigely copper pyrophosphate brightener Cu-203, which ensures a good bonding between the plated layer and the substrate and reduces plating defects.
By optimizing the additive composition, Cu-203 brightener makes the plated layer formed during the plating process more uniform and dense, which not only improves the bonding force of the plated layer, but also enhances the corrosion resistance and mechanical strength.
In summary, the control of PH value plays a vital role in the bonding of the plated layer in the copper pyrophosphate plating process. By keeping the PH value of the plating solution in the proper range and selecting Bigely copper pyrophosphate brightener Cu-203, the bonding strength of the plating layer can be improved to ensure the quality and durability of the plating layer. These measures are important to enhance the performance and reliability of copper plated products.
If you are interested in copper pyrophosphate brightener, please feel free to contact us.
