Localized blistering of the plating is a common quality problem in the production of barrel nickel plating of iron parts, and the following are some of the common causes that may lead to such failures:
In the pyrophosphate copper electroplating process, the control of current density is critical because it directly affects the quality and morphology of the plated layer as well as the deposition rate. Too high or too low a current density can lead to problems with the plated layer, such as roughness, looseness, unevenness, and even defects such as cracks.
In the plating process, the use of acid copper brightener can improve the appearance of the layer brightness, increase the flatness of the copper layer, but when the brightener is used in excess, it will bring a series of problems to the quality of the layer and the plating process. Below we briefly analyze the possible effects of excessive acid copper brightener.
How should the solution concentration, time and temperature of aluminum alloy zinc sinking solution be controlled to ensure that the galvanized layer provides a good bond for subsequent plating?
We know that in the copper-nickel-chromium plating process, there are often a variety of failures, in which the poor bonding of the plated layer is a plater often encountered, then, this issue of the article we will discuss the use of alloy chemical degreasing powder, what are the things need to pay attention to, so as to ensure that the bonding of the plated layer is good.
Electroplating is a physico-chemical process that utilizes electrolysis to form a uniform, dense, and well-adhered coating on metals, alloys, or other conductive materials. During the plating process, the cleanliness of the surface of the workpiece is directly related to the quality of the plating. Especially, electroplating degreasing process is one of the key steps to ensure the quality of electroplating.
