Austenitic stainless steel, with its excellent corrosion resistance and good plasticity, is widely used in demanding industrial fields, such as chemical, food processing and Marine applications. However, when these materials need to operate in more demanding environments, such as high wear or pressure, additional enhancement of surface hardness and wear resistance is necessary. Electroplating hard chromium is an effective means to improve the surface properties of austenitic stainless steel, not only to improve the hardness, but also to maintain or improve the original corrosion resistance.
By using high sulfur nickel additives, we can obtain a very thin nickel rinse layer between the bright nickel layer and the semi-bright nickel layer, which is much more active than the other two layers. The potential difference between the high sulfur nickel layer and the bright nickel layer can be increased by at least 20mv, which improves the corrosion protection of the nickel layer. When we plated high sulfur nickel in the plating layer, but the potential difference of the nickel layer did not improve what to do?
In the pyrophosphate copper electroplating process, the control of current density is critical because it directly affects the quality and morphology of the plated layer as well as the deposition rate. Too high or too low a current density can lead to problems with the plated layer, such as roughness, looseness, unevenness, and even defects such as cracks.
In the plating process, the use of acid copper brightener can improve the appearance of the layer brightness, increase the flatness of the copper layer, but when the brightener is used in excess, it will bring a series of problems to the quality of the layer and the plating process. Below we briefly analyze the possible effects of excessive acid copper brightener.
In the plating industry, zinc replacement solutions are an important part of the pre-treatment of aluminum and its alloys. Aluminum, although widely used for its lightweight and high strength properties, must first overcome its naturally occurring oxide film and low surface activity when it comes to plating other metal layers on its surface. This is because the oxide layer significantly reduces the adhesion of the metal layer. The application of zinc replacement fluids is the key to enhancing this adhesion.
We know that in the copper-nickel-chromium plating process, there are often a variety of failures, in which the poor bonding of the plated layer is a plater often encountered, then, this issue of the article we will discuss the use of alloy chemical degreasing powder, what are the things need to pay attention to, so as to ensure that the bonding of the plated layer is good.
