Recently a customer came to consult the pyrophosphate copper plating brightener, he is doing zinc alloy plating with cyanide-containing alkaline copper, but it is easy to produce defective products, and the plating speed is slow, and he would like to know whether there is any other alternative products. Then pyrophosphate copper plating brightener is a good alternative product.
Acid copper plating brighteners play a key role in the plating process, directly affecting the dispersing ability of the plating solution and the quality of the plated product. The dispersing ability of the plating solution is related to the uniformity and covering ability of the plated layer, which in turn affects the appearance and function of the plated parts. Therefore, how to choose acid copper plating brightener is crucial to improve the effect of plating process.
What are the characteristics of steel chemical degreasing powder, we will talk about it today.
Mr. Zhu is the owner of an electronics component and printed circuit board plating factory in Zhenjiang, Jiangsu Province. Before, Mr. Zhu used a brand of matte tin additive, but due to the decrease of production processing costs and profits, Mr. Zhu required the additive supplier to lower the price appropriately. After that, Mr. Zhu found that the amount of additive used in production had increased by 40% compared to before. As a result, Mr. Zhu's production cost was actually higher than before, so he wanted to find a low-priced and economical matte tin additive.
In plating production, the selection of suitable high temperature nickel additives is essential to improve the quality of the plated layer. High temperature nickel plating plays an important role in the electronics industry, especially in the manufacturing process of electronic components and connectors. In this article, we will introduce Bigely high temperature nickel additive Ni-3000 in detail.
By using high sulfur nickel additives, we can obtain a very thin nickel rinse layer between the bright nickel layer and the semi-bright nickel layer, which is much more active than the other two layers. The potential difference between the high sulfur nickel layer and the bright nickel layer can be increased by at least 20mv, which improves the corrosion protection of the nickel layer. When we plated high sulfur nickel in the plating layer, but the potential difference of the nickel layer did not improve what to do?
