When we use medium phosphorus electroless nickel plating solution for production, there is such a phenomenon: the nickel layer will produce by-products of phosphite during the deposition process. With the production, the concentration of phosphite will become higher and higher, so the reaction rate of electroless nickel plating will be affected and gradually reduced.The deposition rate of the plating solution at the initial and final stages will have a large deviation, so how can we reduce this deviation?
When we use nickel sulfamate additive in the production process, sometimes the brittleness of the nickel coating is large, which affects the performance and quality of the coating.What causes the brittleness of nickel sulfamate coating?
In the production process of using nickel sulfamate additives, sometimes although the stress of the coating is high, it can still meet the requirements, but the heat resistance and corrosion resistance of the coating cannot meet the requirements.So how should we improve the corrosion resistance of the coating?
The semi-bright nickel process is to use semi-bright nickel plating additives in double-layer nickel or multi-layer nickel system electroplating to obtain semi-bright nickel bottom layers with high corrosion resistance requirements.In the production process, we must ensure that the potential difference between the semi-bright nickel layer and the bright nickel layer is 120~145mv, and it has good corrosion resistance.How to maintain the plating solution?
When we use semi-bright nickel plating additives for production, sometimes the composition of the plating solution and process parameters are within the normal range, but the deep plating ability of the plating layer is poor and there are pinholes. What should we do?
Some customers are asking, when using alkaline zinc-nickel alloy additives, in order to ensure the stability of nickel content in the coating, how to control the current density better?