A customer inquired that in the production process of using chemical copper plating additives, the plating solution needs to be continuously stirred with compressed air. Why is this?
Based on on-site experience and the characteristics of the chemical copper plating additive HSECu-801, Bigley Technology analyzed that the reason for the continuous air stirring of the plating solution is to improve its stability and extend its service life.
During the production process of electroless copper plating, copper oxide particles are generated, which are harmful to the plating solution. Air stirring can convert these copper oxide particles back into soluble divalent copper ions, gradually reducing the amount of copper oxide in the plating solution, effectively improving the stability of the plating solution and extending its service life.
In addition, the use of air stirring in the plating solution can cause the micro hydrogen bubbles generated and attached to the surface of the workpiece during the deposition of chemical copper coating to quickly detach from the workpiece surface and escape from the liquid surface. This can effectively reduce the possibility of pinholes or pitting in the coating, and the deposited chemical copper coating is more dense and has better bonding force.
When the chemical copper plating solution is not working, using air stirring can prevent the decomposition of the plating solution, effectively reducing the consumption of chemical copper additives, reducing the addition amount, and saving production costs.
Therefore, in the production process of using chemical copper plating additives, the plating solution needs to be continuously stirred with air to improve its stability and prolong its service life; Reduce the amount of replenishment and save production costs. If you are interested in chemical copper plating additives, please contact Bigley customer service to obtain free samples and detailed technical information!
If you want to learn more about chemical copper plating, you can click to view the "Electroplating Encyclopedia".