Why do fine pockmarks appear in the plated layer when using pyrophosphate copper plating additives?

Why do fine pockmarks appear in the plated layer when using pyrophosphate copper plating additives?

Mon Jul 14 10:03:52 CST 2025

Why do fine pockmarks appear on the coating in the production process using pyrophosphate copper plating additives? It might be caused by the turbidity of the bath solution. Then why does the bath solution become turbid? Overall, there are three reasons.

①Tank liquid temperature is too high

Plating solution temperature control at 40 ~ 50 ℃, if the bath temperature exceeds the upper limit, may accelerate the rate of generation of orthophosphate, and it will also accelerate the volatilization of ammonia, thus reducing the solution conductivity, narrowing the bright range of the plating layer; the serious case will be streaked deposition layer, anode passivation, turbidity of the solution, then do out of the plating layer will appear fine pockmarking failure.

② Massive accumulation of sulfate

When replenishing copper salt, do not add it in the form of copper sulfate, otherwise, it will cause a large amount of sulfate to accumulate, which will make the plating layer harden and become rough easily, and the tank solution turbid (the content of potassium sulfate increases, and crystals precipitate out at low temperatures).

③ Copper powder in the tank

Copper powder will be formed during the plating process, the plating solution should be continuously filtered and periodically treated with activated carbon adsorption to prevent these impurities from accumulating and thus affecting the plating layer.

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Guangdong Bigely Technology Co., Ltd. ,founded in 2003, is a high-tech enterprise integrating R & D,production, sales and service, specializing in the production of electroplating chemicals. As a fast growing electroplating chemicals supplier in China, Bigely Technology has a strong technical service force, a number of engineers have more than 20 years of experience in the electroplating industry, can provide customers with the following services.

Pre-sales: According to the customers' planned plating type and the scale of the future development of plating lines, to provide relevant ancillary services.

In-sales: Sampling analysis, training of on-line and laboratory personnel, testing of each process. 

After-sales: SOP development and troubleshooting countermeasures for the whole line, and other customer requirements.

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