When we use pyrophosphate acid copper brightener, what is the reason that the current is not turned on, the deposition speed is slow and the plating layer is not thick? How should we deal with it?
There are three general reasons why the pyrophosphate acid copper plating process produces such failures:
Reason one: Plating solution temperature is too low, and some electroplating plants dare not increase the plating solution temperature for fear of pyrophosphate hydrolysis in production.
Reason two: It is also possible that the concentration of divalent copper ions in the plating solution is too low, resulting in the current is not big, slow deposition rate.
Reason three: When free potassium pyrophosphate is insufficient and can not be thoroughly combined with copper, the current will not be open; On the contrary, if the potassium pyrophosphate content is too much, it will dramatically reduce the current efficiency.
How to deal with it? We can adjust accordingly for three reasons.
Method one: Increase the plating solution temperature and keep the operating temperature between 50 and 55 ℃.
Method two: Air stirring of the plating solution can bring two benefits:
a. can directly expand the current density range
b. can prevent the production of copper powder
Method three: The addition of Bigely pyrophosphate acid copper brightener Cu-203 increases the upper limit of the cathode current density. As the cathode current density increases, the polarization of the cathode also increases. As you can guess, the crystallization of the coating also becomes finer and tighter, and the production speed of the pyrophosphate process is also increased.