What factors affect the deposition rate of copper pyrophosphate plating?

What factors affect the deposition rate of copper pyrophosphate plating?

Tue Apr 09 08:11:12 CST 2024

The deposition rate of the copper pyrophosphate plating process depends on a number of factors, including the composition of the bath, operating current density, temperature and agitation conditions. In general, when properly operated, copper pyrophosphate plating can achieve relatively fast deposition rates to ensure productivity.

In practice, the deposition rate may vary depending on the operating conditions. For example, higher current density usually leads to an increase in the deposition rate, but if the current density is too high, the quality of the plated layer may be affected, resulting in increased roughness or defects, etc. Therefore, the parameters of the copper pyrophosphate electroplating process need to be adjusted according to the specific application requirements and experimental results.

Bigely copper pyrophosphate brighteners are often used to enhance the appearance of the plated layer, making it brighter and smoother. They help to speed up the deposition rate because they can influence the distribution of the current, resulting in faster copper deposition in areas of high current density on the surface.

If an exact value for the deposition rate is required, it is recommended to refer to the technical data provided by the potion supplier Bigely or to determine it by laboratory tests. A range of recommended values for current density is provided, as well as the theoretical deposition rate under these conditions. In industrial applications, these parameters are adjusted according to actual production requirements and constraints in order to achieve optimum productivity and plating quality.

If you want to know more about the properties of copper pyrophosphate brightener, please contact us.