What are the factors that affect the internal stress of the plated layer during the production process using nickel sulfamate additives?

What are the factors that affect the internal stress of the plated layer during the production process using nickel sulfamate additives?

Tue May 28 09:01:43 CST 2024

When we use nickel sulfamate additives in the production process, a certain amount of internal stress is generated when the crystallization of the plated layer is changed. When the internal stress of the plating layer is large, the hardness of the plating layer is large, easy to peel, crack, and poor ductility. So, what are the factors that affect the internal stress of the plating layer?

Bigely Technology has analyzed according to the characteristics of nickel sulfamate additive Ni-1000, there are mainly these 5 factors:

1, the influence of plating solution composition. The abnormal composition of nickel sulfamate plating solution will affect the stress of the plating solution. When the concentration of the main salt is too high, especially when the chloride ion is too high, the internal stress of the plating layer increases, therefore, we should control the concentration of the components in the plating solution in the process range during production.

2, plating solution pH is not normal. When the plating solution pH value rises, there is a higher pH value near the cathode due to the phenomenon of hydrogen precipitation, which is easy to produce nickel hydroxide particles interspersed in the plating layer, thus increasing the internal stress of the plating layer. Therefore, we should strictly control the pH value of the plating solution between 3.5-4.5 during production.

3. The current density is too high while the temperature is too low. Under the condition of high current density and low temperature, the internal stress of nickel-plated layer will increase obviously. Therefore, we should pay attention to the production of the appropriate current density, and control the plating solution temperature within the normal range.

4, the impact of organic impurities. Organic impurities in the plating solution comes from the excess of additives or the accumulation of decomposition products. When the nickel plating layer is very bright, but the dispersion performance is poor, easy to skin, especially in the high-current area is prone to the phenomenon of cracking, should be used in hydrogen peroxide and activated carbon joint treatment of the plating solution, to remove the effect of organic impurities.

5, the impact of metal impurities. Nickel plating solution, the main metal impurities are zinc, iron impurities. Zinc impurities greatly 0.02g / L when the internal stress of the nickel-plated layer will increase significantly, the layer is brittle. Iron impurities in the content of 0.05g / L or more, will also make the plating layer brittle. When the metal impurities in the plating solution are large, electrolytic plating solution with a current of 0.2-0.4A/dm2 can be used to reduce the influence of metal impurities.

Therefore, we should pay attention to these 5 points in the production process of using nickel sulfamate additives to ensure the good performance of the plating solution, which can also keep the nickel plating layer with low stress and good ductility. If you are interested in nickel sulfamate additives, please contact Bigely for free samples and detailed technical information.