After we use acid copper plating brightener for a period of time, monovalent copper ions will be generated in the plating solution, which will affect the quality of the plating layer.Some customers will use hydrogen peroxide to treat the plating solution, but it will reduce the sulfuric acid content in the plating solution. Why?
Bigolly technology based on the field experience analysis of acid copper plating brightener Cu-510,In the production process, due to insufficient, uneven or no air agitation of the plating solution, the monovalent copper ions generated in the plating solution cannot be oxidized, which easily affects the quality of the coating, such as reduced dispersibility and rough coating.
When there are univalent copper ions in the plating solution, hydrogen peroxide needs to be used for treatment, and they will produce the following chemical reactions, which will consume a part of the sulfuric acid.If the sulfuric acid is not replenished in time, the sulfuric acid content in the bath will gradually decrease.
2Cu+ +H2O2 +2H2SO4 → 2CuSO4 +2H2O +H2↑
It can be seen from the reaction equation that 8.1g of 30% hydrogen peroxide is required to oxidize 1g of monovalent copper ions, and 1.55g of sulfuric acid is consumed.When the content of the plating solution is low, the sulfuric acid content in the plating solution will be lower after the hydrogen peroxide treatment of the plating solution, which may not play a corresponding role.
Therefore, in the production process of using acid copper plating brightener, when using hydrogen peroxide to treat the plating solution, we should timely analyze and adjust the content of each component in the plating solution within the process range to avoid failures.If you are interested in acid copper plating brightener, please contact Bigolly customer service to get free samples and detailed technical information!
If you want to know more about copper plating, you can click to view "Electroplating encyclopedia".
