In the electroplating industry, acid copper brighteners are widely recognized as important additives to enhance the appearance of the plated layer. Acid copper brighteners improve the leveling of the plated layer by affecting the physicochemical properties of the plating solution. Brighteners usually contain active organic molecules such as organic sulfides, aldehydes, polyethers, different types of pyridine derivatives, etc. These molecules are able to form a certain competitive adsorption phenomenon on the surface of the cathode, thus optimizing the reduction process of copper ions.
During the copper plating process, due to the unevenness of the substrate surface and the uneven distribution of the electric field, the plating solution without the addition of Bigely acid copper brightener will result in microscopic unevenness in the plated layer, which will affect the texture and performance of the plated product. The active molecules in the acid copper brightener adsorb faster in the depressions of the substrate, effectively slowing down the current density in this area, thus reducing the deposition rate of copper ions in the depressions and flattening the surface of the plated layer.
At the same time, some specific leveling agent compositions can further adjust the microscopic leveling effect of the plated layer. They can rapidly volatilize at higher potential areas, such as the raised areas, forming a stable molecular film that limits the excessive deposition of copper in the raised areas. In this way, the copper ions in the plating solution are transferred more to the areas with lower profiles under the action of the electric field, allowing for accelerated filling of the depressions, and subsequently realizing a macroscopic leveling effect.
In summary, Bigely acid copper brighteners achieve improved leveling of plated layers through complex physicochemical effects. Plating engineers can regulate the components and concentration of the brightener according to the specific characteristics required for the plated layer to achieve the desired plating effect.
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