Electroless copper plating is a process in which copper ions are reduced by reducing agent and deposited on the surface of conductive substrate without current. The brightness of the coating is one of the important indexes to measure its quality. In order to achieve high brightness of the coating, the choice of additives is very important. The MID rapid electroless copper plating additive HS-ECu-801 developed by Bigely has become the ideal choice for many electroplating plants to pursue high brightness coatings due to its good performance.
Complexing agent and coating brightness
In the process of electroless copper plating, the complexing agent can form stable complexes with copper ions, which affects the deposition rate and the quality of the coating. The properties of complexing agents have obvious influence on copper electrodeposition. Appropriate complexing agents can help balance the release and deposition of copper ions, avoid local overdeposition and improve the brightness of the coating.
Action of additives
Bigely MID rapid electroless copper plating additive HS-ECu-801 utilizes a good complex agent system and stabilizer formulation to ensure stable release of copper ions during deposition while reducing unnecessary side reactions during deposition. The additive can improve the stability of electroless copper plating solution and obtain uniform and bright coating.
Advantages of using Bigely HS-ECu-801
Bigely HS-ECu-801 can:
1. Enhance the brightness of the plating layer: its complexing agent and additives are formulated to make the copper ions released stably during the deposition process to ensure the plating layer is uniform and bright.
2. Improve stability: The additive system improves the stability of the electroless copper plating solution by optimizing the parameters of the solution, avoiding plating defects caused by fluctuations in the solution during the deposition process.
Bigely HS-ECu-801 additives are optimized and designed on the basis of scientific research and in combination with actual production requirements, aiming to achieve suitable results in practical applications. By using HS-ECu-801, electroplating factories can not only significantly improve the brightness of the electroless copper plating layer, but also stabilize the production process and significantly reduce the rate of defective products due to process instability.
In summary, Bigely MID rapid electroless copper plating additive HS-ECu-801, with its good performance and easy operation, has become a suitable choice for electroplating plants to improve the brightness of the coating
If you are interested in rapid electroless copper plating additives, please feel free to contact us.
