Method for determining sulfuric acid content in plating solution using Hull cell test during application of acid copper brightener

Method for determining sulfuric acid content in plating solution using Hull cell test during application of acid copper brightener

Fri Mar 24 17:18:40 CST 2023

A customer inquired about how to use the Hull cell test to determine the copper content in the plating solution during the production process using acid copper brightener?

In acid copper plating solution, it is necessary to ensure a sufficient concentration of copper content in order to have a good dispersion ability and a wide brightness range. When using Bigley's acid copper brightener Cu-510, the content of copper sulfate in the plating solution needs to be controlled between 180 and 240 g/L. The Hull Cell Flaking Test can be conducted as follows:

1. Using a current of 2A for static plating for 5min, the high area of the test piece should have a 1cm scorch; Using a current of 2A, stir the test piece back and forth with a thin glass rod for 3min, so that there is no scorching on the surface of the test piece (when the fog is low in winter, stirring can allow about 3mm of scorching in the high area of the test piece), indicating that the copper content in the plating solution is normal.

2. If a current of 2A is used for static plating for 5min and there is no scorching of the coating, it indicates that the copper content in the plating solution is on the high side. It is necessary to dilute the plating solution and add an appropriate amount of sulfuric acid and cylinder opening agent Cu-510Mu. When the bath temperature is low (below 10 ℃), the copper content in the bath is too high, the anode dissolves poorly, and the polarization of the anode is too large, making the copper anode easy to passivate.

3. If the current of 2A is used for static plating for 5min, and the high area of the plating layer exceeds 1.5cm, it indicates that the copper content in the plating solution is insufficient. It is necessary to quickly add copper sulfate and adjust it to about 1cm in the high area of the test piece during the plating process.

Therefore, in the production process of using acid copper brightener, we can use the above Hull cell lamination method to determine the copper content in the plating solution, and maintain a good dispersion ability of the plating solution. If you are interested in copper acid brighteners, please contact Bigley Customer Service for free samples and detailed technical information!

If you want to learn more about copper plating, you can click to view the "Electroplating Encyclopedia".