If there is no wetting agent added in the bright copper plating process, what will it happen?

If there is no wetting agent added in the bright copper plating process, what will it happen?

Mon May 13 08:34:57 CST 2024

Wetting agents play an important role in the bright sulfate copper plating process , mainly used to reduce the surface tension, so as to improve the contact between the bath solution and the surface of the object to be plated, to enhance the fluidity of the solution and to prevent the adhesion of air bubbles on the surface of the workpiece. Failure to add a wetting agent to the bright sulfate copper plating bath can lead to a variety of plating failures.

First, failure to add a wetting agent usually leads to problems with bubble adhesion. During bright sulfate copper plating, hydrogen gas is usually generated on the surface of the cathode (the object being plated), and without adequate wetting agents to reduce surface tension, these bubbles are difficult to separate from the surface of the workpiece. This can result in the bubbles being trapped underneath the plating and forming holes or pinholes, which not only affects the appearance of the plating, but also weakens the protective ability and mechanical strength of the plating.

Secondly, the lack of wetting agent will also reduce the effective contact area between the bath and the plated surface, making some areas not adequately plated. This will lead to uneven thickness distribution of the plated layer, especially on complex shapes or workpieces with blind holes, which may result in weak localized plating, affecting the overall protective effect of the plated layer and its mechanical properties.

In general, the role of wetting agent in the bright sulfate copper plating process is crucial, it not only relates to the quality of the plated layer, but also affects the stability and efficiency of the whole plating process. Therefore, when using Bigely acid copper brightener Cu-510, you need to control the amount of wetting agent, so as to obtain good quality plating layer.The adjustment of Cu-510 is relatively simple, divided into the opening agent, leveling agent, brightening agent, wetting agent, and the amount of additives can be determined through the Hull Cell test in the actual production.

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