How to judge the bonding strength of plating after using electroless nickel plating solution?

How to judge the bonding strength of plating after using electroless nickel plating solution?

Mon Apr 14 10:30:33 CST 2025

After we use electroless nickel plating solution, how to judge whether the bonding between the plating layer and the substrate is good or bad?

After we use electroless nickel plating solution, how can we judge whether the bonding of the plating layer with the substrate is good or bad? We can refer to the corresponding standards, using the grid method to detect the bonding of plating. Specific operation is as follows: on the surface of the plating with a hundred grid knife in two mutually perpendicular directions, to get a large number of 1 mm x 1 mm squares, and then with a width of 25 mm, length of 75 mm tape pasted in the center of the grid area, and in 1 ~ 2 min towards the direction of the paste 180 ° tear off the tape, to observe the peeling of the plating situation.

After applying the electroless nickel plating solution, the plating bonding strength is categorized into 6 grades based on the peeling of the plating on the workpiece:

5B: Tangent line complete, smooth, no flaking

4B: Slight flaking of the plating at the intersection of the tangent lines, less than 5%

3B: Slight flaking of plating at line intersections and tangent edges, 5%~15% flaking

2B: Spalling of tangent edges and localized chevron areas, 15% to 35% spalling

1B: Most of the cut line edges and chevron areas peeled off, 35% to 65% flaking

0B: Flaking more than 65%

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