Adjusting the pH of the copper pyrophosphate plating process is a factor in ensuring the quality and performance of the plated layer, and we need to use a number of specific chemicals for careful pH regulation to meet different plating needs.
In copper pyrophosphate plating process, the pH value is usually optimized in the range of 8.6 to 9.2. This pH range maintains the stability of the plating process and results in uniform, bright deposits. To adjust the pH, alkaline substances such as potassium hydroxide or sodium hydroxide are usually added to the plating solution in practice. When used, it should be added carefully in batches and gradually in a continuously stirred bath to avoid localized concentrations that are too high and lead to uneven plating.
If the pH value of the plating solution is high, an acid can be added to lower the pH value, usually phosphoric acid or pyrophosphoric acid is chosen. Various additives for pH adjustment should be carefully selected and the ratio should be strictly controlled, because too many additives may affect other properties of the plating solution, including the structure and adhesion of the plated layer.
While adjusting the pH, plating engineers also need to monitor the concentration of copper ions in the solution and the ratio of other additives to ensure the continuity and microstructure of the plated layer. This further maintains the stability of the plating solution and improves the overall economy of the plating process.
In conclusion, when using Bigely copper pyrophosphate plating process, pH adjustment is a matter that needs to be taken seriously, and plating plants can consult with Bigely engineers on how to control it in order to ensure that the quality of the plated layer and its performance can meet the requirements of the customer's order.
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