Electroplated tin layer plays a crucial role in the field of electronic plating, which not only affects the appearance quality of electronic components, but also directly relates to their performance and life. Among them, the high temperature reflow test is one of the important means to verify the quality of plating layer. So, how to pass the high temperature reflow test for electroplated tin layer?
First, we need to understand how high temperature reflow soldering works. High temperature reflow soldering refers to the process of placing a soldered component under a specific temperature profile so that the solder melts and bonds firmly with the base material. During this process, the electroplated tin layer needs to undergo several high temperature heating and cooling cycles, which provides good resistance to high temperatures and excellent solder strength.
In order to ensure that the electroplated tin layer can successfully pass the high temperature reflow test, we need to focus on the following main aspects:
1. Quality of plating: Factors such as purity, uniformity and thickness of the plating will directly affect its quality. High purity tin plating layer can reduce the influence of impurities, enhance its stability in the high temperature environment.
2. Solderability: The solderability of the tin plating is critical to passing the high temperature reflow test. The presence of oxides or other impurities in the plating can reduce its solderability and lead to failure. Therefore, it is very important to keep the surface of the plating clean.
3. Antioxidant performance at high temperature: the plating layer is easy to oxidize at high temperature, thus affecting its performance. Selection of additives with good antioxidant properties can effectively reduce such problems.
4. Stress-strain resistance: solder joints in the high-temperature reflow soldering process will produce stress-strain, the tin layer is required to have a high shear strength and good stress resistance.
Bigely electroplated tin additive Sn-807 was designed with these needs. Sn-807 not only improves the purity and homogeneity of the plated layer, but also optimizes the stability and antioxidant properties of the plated layer at high temperatures, enabling it to pass the high temperature reflow test without any problems. In addition, Sn-807 improves the solderability of the plated layer and reduces the generation of oxides to ensure solder quality.
In summary, passing the high temperature reflow test is not an easy task for electroplated tin layers, which need to be improved and optimized in a number of ways. With the help of electroplated tin additives such as Sn-807, the quality of the layer can be improved so that it can perform well in the high temperature reflow process and meet the needs of modern electronics manufacturing.
If you are interested in tin plating additives, please feel free to contact us.
