Four reasons for poor stability of plating solution when using acid copper brightener

Four reasons for poor stability of plating solution when using acid copper brightener

Wed Feb 01 09:14:18 CST 2023

    In the production process of using acid copper brightener, we need to maintain and manage the plating solution and add the brightener correctly, so as to obtain a uniform bright coating with good filling and low porosity.Sometimes the stability of the plating solution is poor, and problems such as decreased brightness and rough coating will occur, which will affect the quality of the coating. What is the reason for this?

    According to the site experience and the characteristics of the product acid copper brightener Cu-510, Bigolly Technology has analyzed the following four reasons:

    1. The ratio of brightener and leveling agent in the plating solution is improper.In acid copper plating solution, the proper proportion of brightener and leveling agent should be controlled, rather than increasing their content.Practice has proved that adding too much brightener in the plating solution will not only be beneficial to the brightness of the coating, but will increase the decomposition products of additives, form organic impurities, seriously affect the quality of the coating, and greatly shorten the service life of the plating solution.

    2. The quality of copper anode is poor.The phosphor copper anode used shall be the phosphor copper anode with a phosphor content of 0.04%~0.06% and which has been calendered.The phosphorus content of the anode plate is too low, and the surface will be red during electroplating, which is easy to produce copper powder, making the coating rough and not bright.When the phosphorus content is high, serious black film will be produced on the surface of the anode plate during electroplating, which will pollute the plating solution.When the phosphorus content is too high, the anode plate is prone to passivation and oxygen evolution, resulting in abnormal decomposition of additives and instability of the plating solution.

    3. The influence of bath temperature.The temperature of the plating solution shall be controlled between 20~40 ℃.If the temperature is too low, the current density of the cathode will be relatively low, and the copper sulfate crystal is easy to precipitate;If the temperature is too high, although it can improve the conductivity of the plating solution, it will reduce the brightness of the coating, and the coating will be relatively rough.

    4. The influence of monovalent copper ion.If air stirring or circulating filtration is not used in the production process, after a period of production, there will be the influence of monovalent copper ions, which will accumulate the decomposition products of additives, resulting in poor color and quality of the coating, and unstable plating solution.

    Therefore, in the process of using acid copper brightener, we should strengthen the maintenance and control of the plating solution, as well as the correct addition of additives, in order to ensure the stability of the plating solution.If you are interested in copper acid brightener, please contact Bigolly customer service for free samples and detailed technical information!

    If you want to know more about copper plating,you can click to view "Common problem".