Electroless copper plating is a process in which copper ions are reduced and deposited on the surface of a conductive substrate by means of a reducing agent without the need for an electric current. The brightness of the plated layer is one of the most important indicators of its quality. The choice of additives is crucial in order to achieve a high brightness layer.
The fast electroless copper plating additive HS-ECu-801 developed by Bigely Technology has become the ideal choice for many plating plants in pursuit of high brightness coatings due to its good performance.
Advantages of using Bigely HS-ECu-801
1. Improve brightness of plated layers: Bigely's fast electroless copper plating additive HS-ECu-801 utilizes a good complexing agent system and stabilizer formulation that ensures a stable release of copper ions during deposition, while reducing unwanted side reactions during deposition. The additive improves the stability of the electroless copper plating solution, resulting in a uniform and bright coating.
2. Improve stability: The additive system improves the stability of the electroless copper plating solution by optimizing the parameters of the solution, avoiding plating defects caused by fluctuations in the solution during the deposition process.
Why can you trust Bigely?
Guangdong Bigely Technology Co., Ltd. ,founded in 2003, is a high-tech enterprise integrating R & D，production, sales and service, specializing in the production of electroplating additives. As a fast growing electroplating additives supplier in China, Bigely Technology own a strong research and development team, which has over 10 engineers with more than 20 years' working experience in the electroplating industry.
The core raw materials of our products are made of international brand products such as BASF from Germany with high purity and low impurity.
If you need our high-quality electroplating additives, please contact us. We can provide you samples to you for test, and also provide a series of services.
