In the bright acid copper plating process, the leveling of the plated surface is one of the important indicators of the quality of the plated layer. However, in the process of using bright acid copper brightener, sometimes there is a problem of decreasing leveling of the plated surface, which not only affects the aesthetics of the plated layer, but also may have a negative impact on the performance of the product. In this paper, we will discuss and analyze this problem from various angles.
First of all, the content of copper sulfate in the plating solution is one of the important factors affecting the filling degree of the plated layer. Too low a content of copper sulfate will lead to a decrease in the permissible current density and a corresponding decrease in the cathodic current efficiency, thus affecting the filler properties of the plated layer. Therefore, when using acid copper brighteners, such as Bigely acid copper brightener Cu-510, the copper sulfate content in the plating solution should be strictly controlled to be within the process range, such as between 180~240g/L, to ensure that good leveling effect is obtained.
Secondly, the content of chloride ions also has an important effect on the filler properties of the plated layer. Chloride ion is an indispensable inorganic anion in the acid copper process, and it is essential for obtaining the desired bright plating layer. However, too high or too low a chloride ion content can lead to poor leveling of the layer. Bigely acid copper brightener Cu-510 has good leveling properties at a chloride content of 70~100ppm. Therefore, in the production process, the content of chloride ion should be strictly controlled to avoid too high or too low.
In addition, the additive disorder of acid copper brightener is also one of the reasons for the decrease of plating leveling. Brightener replenishment should be carried out in strict accordance with the process parameters, and the concentration of brightener should be analyzed regularly by Hull bath experiment. If the replenishment is not proper, such as when the content of filler Cu-510A is low, the crystallization of the plated layer will be rough and the leveling effect will be poor. Therefore, when using acid copper brightener, special attention should be paid to the way of brightener replenishment and replenishment amount to ensure the filling level of the plated layer.
About us
Guangdong Bigely Technology Co., Ltd. ,founded in 2003, is a high-tech enterprise integrating R & D，production, sales and service, specializing in the production of electroplating additives. As a famous electroplating additives source manufacturer in China, Bigely has over 20 years' experience in electroplating additives production and own production base of 5000 square meters. We can produce 15,000 tons of electroplating additives every year, which can fully meet the needs of customers.
Bigely Technology is a national high-tech enterprise with a strong research and development team, which has over 10 engineers with more than 20 years' working experience in the electroplating industry.
If you need our high-quality electroplating additives, please contact us. We can provide you samples to you for test, and also provide a series of services.
