Sulfate matte tin plating process occupies an important position in the field of electronic packaging and is widely used for its excellent conductivity and oxidation resistance. However, in practice, the leakage of plating is an urgent problem to be solved. In this paper, we will discuss the causes of leakage plating and the corresponding solutions.
The basic principle of the sulfate matte tin plating process is to use an electrolytic process to deposit tin ions onto the surface of the substrate, which in turn forms a fine tin plating layer. First, the substrate is pre-treated, including cleaning and pickling steps, to ensure a clean and active surface. Subsequently, the substrate is immersed in an electroplating bath containing a sulfate mist tin plating solution, and by the action of an electric current, tin ions are reduced on the surface of the substrate to form a plated layer.
However, in the actual operation process, the phenomenon of plating leakage occurs occasionally, the main causes include the following aspects:
1. Incomplete surface pretreatment: If the surface of the substrate is not thoroughly cleaned, the residual oil or oxide film will hinder the formation of the plating layer and lead to leakage.
2. Uneven current distribution: During plating, an even current distribution is required to ensure uniformity of the plated layer. If the current is too high or too low, the integrity of the plated layer will be compromised.
3. Unreasonable selection of additives and process parameters: additives play an important role in the tin plating process, poor quality or unsuitable additives will lead to plating defects.
Therefore, optimizing the pretreatment process, selecting suitable additives and controlling the current distribution are the keys to solving the leakage plating problem.
To counteract the problem of plating leakage, the use of Bigely acid matte tin additive Sn-808 can improve the quality of the plated layer and avoid leakage caused by uneven current distribution. This can be seen in the following areas:
1. Improve current efficiency: Bigely additives optimize the conductivity of the electrolyte and ensure an even distribution of the current, thus reducing the occurrence of leakage plating.
2. Improve the structure of plating layer: these additives are conducive to the rapid reduction of tin ions on the surface of the substrate, the formation of dense, uniform plating layer, effectively avoiding plating defects.
In summary, in sulfate matte tin plating process, we need to comprehensively consider factors such as surface pretreatment, current control and acid matte tin additive selection when solving the leakage plating problem.
If you have any demands for acid matte tin additives, please feel free to contact us.
