Electroless nickel plating technology is widely used in industrial fields, and the hardness of nickel layer is an index to guarantee the wear resistance of parts. This article summarizes the main factors affecting the hardness of electroless nickel plating layer: bath composition, plating solution pH, temperature.
Bath composition plays an important role in the hardness of the nickel layer during electroless nickel plating. The type and concentration of nickel source, reducing agent, compound stabilizer and buffer must be controlled. The quality of the nickel source affects the deposition rate of the nickel metal; the type and concentration of the reducing agent is directly related to the activity and efficiency of the deposition reaction; and the individual additives, which contribute to the formation of a denser, more even nickel layer, increase the hardness. For this reason, we recommend the use of Bigely electroless nickel plating solution, which is a well-proportioned commercial concentrate that produces plating hardnesses in the range of 550-650 HK100.
pH is another key parameter controlling the deposition reaction, which affects the rate of nickel deposition and the structural compactness of the deposited layer. A moderate pH range results in better crystallization of the nickel layer, which enhances the hardness. Low pH usually favors high hardness of the deposited layer.
Temperature also has a significant effect on the hardness of the coating. Temperature increases accelerate chemical reaction rates and ion migration, but too high a temperature may reduce hardness due to grain growth. Appropriate temperature control can balance the deposition rate and grain refinement to increase the hardness of the coating.
The hardness of the electroless nickel plating layer is affected by a variety of factors. By controlling the bath composition, pH, temperature and the use of Bigely electroless nickel plating solution, the hardness of the nickel layer can be effectively improved to broaden its wear resistance requirements in industrial applications. In the future, in-depth study of these factors will further optimize the electroless nickel plating process and enhance the plating performance.
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