We all know that in the production process of using sulfate tin plating additives, the plating solution is easy to become turbid, which reduces the performance of the plating solution and affects the quality of the galvanized layer of the workpiece.So how should we alleviate the turbidity of the plating solution?
1. Control the temperature of the plating solution.The temperature of the sulfate tin plating solution should be controlled at about 20 °C as much as possible.When the temperature is too low, the conductivity of the plating solution is poor, the allowable current density is small, and the deposition rate of the plating layer is slow.When the temperature is high, the local temperature of the anode plate will increase, and the plating solution will easily produce Sn4+ and become turbid.
2. Control the cathode current density.When the cathode current density is too large, the anode plate is easily passivated and blackened, the current efficiency decreases, and the plating solution becomes cloudy;When the current density is too small, the deposition rate of the coating is slow.According to experience, the cathode current density of sulfate electroplating tin is in the range of 1~3A/dm2, and the current is too high or too low, which is unfavorable to the plating solution.
3. Control the concentration of sulfuric acid in the electroplating solution.In order to prevent the hydrolysis of Sn2+, the mass ratio of stannous sulfate and sulfuric acid should be maintained between 1:3 and 4 during the production process.And the plating solution should always be analyzed to adjust the concentration of sulfuric acid within the normal range.
Therefore, we need to remember the above three points in the production process of using sulfate tin plating additives, which can effectively alleviate the turbidity of the plating solution and reduce the occurrence of failures.