With the rapid development of electronic industry and precision manufacturing, high quality tin plating layer has become a key factor to prolong product life and improve performance. In this context, Sn-819 high-speed bright tin plating additive introduced by Bigely has attracted the attention of plating factories with its good performance. The purpose of this paper is to introduce in detail the role of Sn-819 in tin methanesulfonate plating solution and its positive impact on the performance of plating solution and layer.
The tin plating additives used in the sulfate matte tin plating process have a direct impact on the quality of the plated layer, and the plated layer scratching is often related to the use and regulation of these additives. The type of additives, their concentration and their ratio in the plating solution will affect the final quality of the plated layer.
In acid tin plating process, the plating solution turbidity not only affects the product appearance, but also may bring quality problems. Don't worry, we can teach you a few tricks, so that your plating solution as clear as ever!
Some customers inquired that during the production process using semi-bright nickel additives, the bonding of the plating layer is poor, resulting in the semi-bright nickel plating layer coming off easily, what is the reason for this?
By using high sulfur nickel additives, we can obtain a very thin nickel rinse layer between the bright nickel layer and the semi-bright nickel layer, which is much more active than the other two layers. The potential difference between the high sulfur nickel layer and the bright nickel layer can be increased by at least 20mv, which improves the corrosion protection of the nickel layer. When we plated high sulfur nickel in the plating layer, but the potential difference of the nickel layer did not improve what to do?
Localized blistering of the plating is a common quality problem in the production of barrel nickel plating of iron parts, and the following are some of the common causes that may lead to such failures:
