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Princeps celeritatis et humilis accentus nickel additivus
Ni-1000 acidum sulfamicum processum electroplantis
1. Introductio
Processus est amino sulfonic acidi genus nickel processus plating. Nikel vestiens semi-nitida vim habet humilem et ductilem bonam. Aptissime utendum est pro fundo strato metallorum et stratis metallicis communibus, et late in fabricandis partium electronicarum adhibitis, cum maximis requisitis, sicut tabulae ambitus impressae, semiconductores et connexiones.
2. processus characteres
1, sulfamic acidum genus nickel plating elogium, semi-nitens, humilis accentus, ductilis bonum nickel plating stratum;
2, amplis densitatis currentis, potest patella ad densitatem currentem altiorem, altam. patella celeritas;
3, alta tolerantia ad fossilium immunditiae;
4, litura innixa nimis vel moderata accentus, color tunica uniformis et ductilis, porositas humilis. @_ Optima valor parametri ditionis range
Nickel sulfamatus 400~800 mL/L 600 mL/L
acidum boricum 35~45 g/L 40 g/L
Nickel chloridum 5~15 g/L 10 g /L
NI-1000A mollior 8~12 mL/L 10 mL/L
Ni-1000B aequans agens 0.1~ 0.3ml /L 0.2ml /L
NI-382 udus 1~3 ml/ L 2 mL/L
PH 3.5 ~ 4.5 4.0
Temperature 50 ~ 60 ℃ ad 55
Ad vehementer excitandum aerem seu machinationem
Cathodae densitatis currentis 2~6 ASD 4 ASD
The. anode ponitur in canistro titanium continens sulfidium nickel vel platinum titanium
Equipment requisita
1. Ferro piscinam PVC, PVD vel PP instruxit;
2. laniatus rectifier coefficiens <5%;
3. Utere 3 m PP elementum colum et saccum spargere;
4. Sentinam et colum apparatum ex iners materia vel enascentia fieri debet;
5. Utere PP anode sacco;
6. nickel electrolytico puro uti non potest ut anode, uti debet volvens, demagnetizationem nickel vel SD generis nickel ut anode materia;
7. Utere titanio anode hamo et canistro titanii;
8. Vicus vel Titanium calefacientis;
9. VENTILATIO machinis in workplace erigi debet.
Additivum munus et supplementum
Energy consumptio additivi
NI-1000A lenientis accentus levamen agentis, positio agentis 150~ 250 mL/KAH
Ni-1000B aequandi agens aequandi agens, clarior 10~50 mL/KAH
NI-382 udus agens pinhole eliminationis agens, cum necesse est ad solutionem conservandam
plating
1. Princeps puritatis nickel sulfonate incumbit ad foramen cylindricum et repletionem nickel in balneis, si necesse est.
2. Balneum pH valorem circiter 4.0 conservatum est optimum, solum cum amino acido ad valorem pH reducendum, carbonas nickel ad valorem pH augendum.
3. Cum organica sordes in balineo gravis est, necesse est ut cum carbone actum balneum tractaret. Quaeso consule virgam technicam nostram.@___@4. In pollutione stagni, plumbi et aliorum divulgationis metallicae electroplatandi efficientiam et plating accentus afficiet. Contentum immunditiae metallicae moderari debet infra 10ppm.
Disclaimer: Omnes suggestiones de nostris fructibus in hoc documento technico nituntur experimentis et notitiis nostris sodalitati creditis. Operatores et apparatus variantur e regione ad patriam, ergo societas praestare non potest nec responsabilis est ad aliquas adversas consequentias. Nulla notitiarum quae in hac Methodo Troubleshooting continentur, praeiudicio librariae testimonium est.
3. When the organic pollution in the bath is too heavy, it is necessary to treat the bath with activated carbon. Please consult our technical staff.
4. The pollution of tin, lead and other metal magazines will affect the electroplating efficiency and the plating stress. The content of metal impurities must be controlled below 10ppm.
Disclaimer: All suggestions on our products in this technical document are based on the experiments and data trusted by our company. Operators and equipment vary from country to country, so the company cannot guarantee and is not responsible for any adverse consequences. None of the information contained in this Troubleshooting Method is evidence of copyright infringement.
