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Sn-818 is a fluorine-free tin and tin-lead process that can be used for rack plating,barrel plating and continuous electroplating. In a wide range of current density,a thin,fine,misty and uniform coating can be obtained.
Sn-808 Matt Tin Additive is a low-foam matt tin process based on sulfuric acid. The coating is smooth and can produce a solderable anti-corrosion coating.
Sn-819 is a tin plating process based on methanesulfonic acid substrate. The coating is bright, suitable for rack plating and barrel plating. The weldability of the coating is superior. The plating solution does not corrode titanium, ceramics, and glass.
Sn-819 is a tin plating process based on methanesulfonic acid substrate. The coating is bright,suitable for rack plating and barrel plating. The weldability of the coating is superior. The plating solution does not corrode titanium,ceramics,and glass.
After the Ni-351 microporous nickel plating process is used together with Bigley's copper, semi-gloss nickel, all-gloss nickel and chromium processes, the number of micro-holes provided can reach more than 30,000/cm², which can greatly increase the nickel The corrosion resistance of the layer meets or exceeds all current OEM specifications. Simple operation and easy management.
The Sn-830 pure tin process affects the coordination of tin ions in the nearly neutral plating solution,thereby solving the phenomenon of sticking of small workpieces. It is specially designed for the barrel plating application of small-size workpieces,and can obtain a smooth and uniform semi-gloss pure tin plating layer in a very wide current density range.
( 1 ) The coating is bright blue and has good decorative properties . ( 2 ) The coating has good brightness, toughness and chromium coating performance. ( 3 ) Less organic decomposition products and high tolerance to impurities. ( 4 ) The plating solution is stable and easy to control and maintain.
Especially suitable for multi-layer nickel plating process with strict anti-corrosion performance.<br> Contain an amount of conductive particulate additive is not uniformly distributed on the bright nickel layer, ( . 3 million or more pores / cm), so that the chromium layer is formed on the porous chromium, thereby improving the corrosion resistance.
Ni-331. is a new sulfur-free nickel plating process, which can produce a coating with good ductility, moderate brightness and good leveling properties.<br> This process is used as a base layer for multi-layer nickel plating and is suitable for iron and copper parts, zinc die-cast parts and polished copper surfaces. <br> <br> Because of the moderate coating thickness, this combined coating can provide excellent corrosion protection (especially in Step, CASS and Corrodkote tests).<br> <br> There is no need for periodic batch purification.
The process is a sulfamate nickel plating process Ni-1000, the semi-bright nickel plating layer has low stress and good ductility. It is very suitable as the bottom layer of precious metals and ordinary metal layers, and is widely used in high requirements such as printed circuit boards, semiconductors, and connectors. The field of electronic component manufacturing.
