Izinto ezinhlanu eziyisisekelo ze-electroplating:
1. I-Cathode: Into ezogqitshwa ibhekisela kumatheminali okuxhuma ahlukahlukene.
2. I-Anode: Uma kuyi-anode encibilikayo, iyinsimbi okufanele icwecwe. Endabeni yama-anode angancibiliki, iningi lawo izinsimbi eziyigugu (i-platinum, iridium oxide).
3. I-Electroplating potion: i-electroplating potion equkethe ama-ion ensimbi okumele acwecwe.
4. Ithangi le-Electroplating: ithangi elingathwala futhi ligcine isisombululo se-electroplating, ngokuvamile kucatshangelwa izici ezifana namandla, ukumelana nokugqwala, nokumelana nezinga lokushisa.
5. Isilungisisi: Idivayisi enikeza amandla e-DC.
Inhloso yoplatform kagesi: Ngaphezu kokudinga ubuhle, i-electroplating inezinjongo ezihlukile ngokuya ngezidingo ezahlukahlukene ze-electroplating.
1. I-Copper Plating: isetshenziselwa i-primer ukuze kuthuthukiswe ukunamathela nokumelana nokugqwala kongqimba olunama-electroplated.
2. I-Nickel plating: isetshenziselwa i-primer ukuthuthukisa ukumelana nokugqwala.
3. Igolide plating: ngcono conductive ukuthintana impedance futhi uthuthukise ukudluliswa kwesignali.
4. I-Palladium nickel plating: thuthukisa ukumelana nokuxhumana, uthuthukise ukudluliswa kwesignali, futhi ube nokungagugi kangcono kunegolide.
5. I-tin-lead plating: thuthukisa amandla e-soldering
Ukwakheka kwe-electroplating potion;
1. Amanzi ahlanzekile: ukungcola okuphelele kufanele okungenani kube ngaphansi kuka-5ppm.
2. Usawoti wensimbi: nikeza ama-ion ensimbi azogqitshwa.
3. I-anode dissociation aid: ukuthuthukisa nokulinganisela izinga lokuhlukaniswa kwe-anode.
4. Usawoti oconductive: thuthukisa ukuguquguquka komuthi.
5. Izengezo: i-ejenti yokubhafa, i-ejenti ecwebezelayo, i-ejenti eshelelayo, i-ejenti ethambisayo, i-ejenti yokumanzisa, inhibitor.
Izimo ze-Electroplating:
1. Ukuminyana kwamanje: indawo yamanje yeyunithi ngayinye ye-electroplating. Ngokuvamile, ukuphakama kokuminyana kwamanje, kulapho ukujiya kwefilimu kushubile, kodwa uma ukuminyana kwamanje kuphezulu kakhulu, okokunamathela kuzosha futhi kube mahhulu.
2. Indawo ye-Electroplating: Ukuma kwengxenye epuletiwe kubhavu, uma kuqhathaniswa ne-anode, kuzothinta ukusatshalaliswa kogqinsi kwefilimu.
3. Izimo ezinyakazayo: lapho umphumela onyakazayo ungcono, kulapho ukusebenza kahle kokucwenga kuphezulu, kunezindlela ezinyakazayo ezinjengomoya, ukugeleza kwamanzi, nokushwibeka kwe-cathode.
4. I-waveform yamanje: Ngokuvamile, lapho ukuhlunga kungcono, kulapho ukwakheka kwamagagasi kufana kakhulu.
5. Izinga lokushisa lokugeza okucwebezelayo: lingaba ngu-50-60 locwecwe ngegolide, licishe libe ngu-50-60 le-nickel plating, licishe libe ngu-18-22 le-tin-lead plating, futhi licishe libe ngu-45-55 le-palladium-nickel plating.
6 PH inani lesisombululo sokucwenga : igolide plating cishe 4.0~4.8, nickel plating cishe 3.8~4.4, palladium nickel plating cishe 8.0~8.5,
7. Amandla adonsela phansi athile esixazululo se-plating: Ngokuyisisekelo, amandla adonsela phansi athile aphansi, ukuqhutshwa kwesisombululo kubi, futhi ukusebenza kahle kokucwenga akukuhle.
