What are the reasons that lead to poor stability of the electroless copper plating solution and frequent decomposition during its usage?
High concentration of the plating solution components
When the concentrations of copper ions, formaldehyde and alkali are too high, although the deposition rate can be increased, the stability of the solution will decrease. Therefore, there is a limit rate for electroless copper plating. Once this rate is exceeded, if the temperature is at a relatively high level at this time, the stability of the solution will significantly decrease. Therefore, one should not blindly allow copper plating to proceed at a high rate.
Excessive loading
The electroless copper plating solution has a certain loading capacity. If the loading exceeds the loading capacity of each liter of the plating solution, it will accelerate the reduction reaction of the solution itself. Therefore, when using the electroless copper plating solution from Bigely, it is necessary to operate according to the loading capacity recommended by our engineers.
The stability of the complexing agent has declined
If the complexing agent is insufficient or the used complexing agent is not sufficient to ensure the stability of the metal ions, the stability of the plating solution will also decline.
About us
Guangdong Bigely Technology Co., Ltd. ,founded in 2003, is a high-tech enterprise integrating R & D，production, sales and service, specializing in the production of electroplating additives. As a famous electroplating additives source manufacturer in China, our products are widely used to meet the plating needs of different industries and exported to many countries from all over the world. They can meet the environmental protection standard after use, mainly used in automobile parts, sanitary ware, electronic products, hardware, furniture, building accessories and other fields.
If you need our high-quality electroplating additives, please contact us. We can provide you samples for test, and also provide a series of services.
