During the production process of using bright nickel plating additives, due to the weakly acidic plating solution, it is relatively easy for nitrate ions to mix in, which may lead to malfunctions. So how can we quickly remove nitrate from the plating solution?
As nitrate is an oxidizing agent, it will damage the composition of the brightener and reduce the range of brightening current density at the same time. A small amount of nitrate will reduce the dispersion ability and deep plating ability of the plating solution, making the nickel plating layer thinner at low current density, and even causing missed plating. The plating layer will turn slightly blue. At this time, measures such as adding additives will not improve the situation.
Take Bigely bright nickel plating additive Ni-301 as an example. The plating solution can be taken for the shell cell wafer test: the current density is 0.2A, the time is 10 minutes, the electroplating is stationary, the temperature is 55℃, and the pH value of the plating solution is about 4.0. When nitrate is present in the plating solution, black stripes will appear in the medium and high zones of the test piece, the medium and low zones will turn yellow, and there will be missed plating in the low zone. At this point, the plating solution can be treated in the following way:
The nitrate content in general plating solutions is not very high, and sodium bisulfite can be used for treatment. First, determine the dosage of sodium bisulfite using the Hull bath experiment. When adding to the plating solution, dissolve the sodium bisulfite into a 5-10% aqueous solution first, and then add it to the plating solution under vigorous stirring. After adding, stir the plating solution for another 30 minutes to decompose the nitrate. Then, the diluted hydrogen peroxide solution was added to the plating solution under vigorous stirring to remove the residual sodium bisulfite. After that, adjust the process parameters properly, and then conduct the chip test in the Hull bath. Once the chip test is normal, adjust the plating bath. In this way, normal production can be carried out.
About Bigely Technology
Guangdong Bigely Technology Co., Ltd. ,founded in 2003, is a high-tech enterprise integrating R & D，production, sales and service, specializing in the production of electroplating additives. As a famous electroplating additives source manufacturer in China, Bigely Technology is a national high-tech enterprise with a strong research and development team, which has over 10 engineers with more than 20 years' working experience in the electroplating industry.
If you need our high-quality electroplating additives, please contact us. We can provide you samples for test, and also provide a series of services.
