In the previous article, we talked about two reasons why mechanical impurities can cause rough plating when using copper pyrophosphate brighteners, in addition to the other 2 reasons why mechanical impurities can also occur. These are the introduction of anode sludge and external fallout.
Anode sludge introduction
In the production of copper pyrophosphate brightener application, after the dissolution of soluble anode, more or less anode sludge will be produced. When the anode is not added with anode bag, the anode bag hole is larger or the anode bag is broken, the sludge will enter the plating solution.
If the auxiliary anode is not wrapped in an anode bag when plating a cassette-shaped workpiece, the bottom surface of the cassette will be rough after plating due to the accumulation of slag.
What kind of anode plate should we use in copper pyrophosphate plating production?
According to the experience of Bigely technical engineers, oxygen-free high conductive copper (OFHC) and rolled copper are preferred for copper pyrophosphate plating anodes. Anode current efficiency is greater than 95%. Electrolytic current efficiency is low, 85%~90%.
Although the current efficiency of phosphorus-containing deoxidized copper in acid copper plating is high, it produces anode slag, causing plating pitting, and is not suitable for use.
About us
Guangdong Bigely Technology Co., Ltd. ,founded in 2003, is a high-tech enterprise integrating R & D，production, sales and service, specializing in the production of electroplating additives. As a famous electroplating additives source manufacturer in China, Bigely has over 20 years' experience in electroplating additives production and own production base of 5000 square meters. We can produce 15,000 tons of electroplating additives every year, which can fully meet the needs of customers.
If you need our high-quality electroplating additives, please contact us. We can provide you samples for test, and also provide a series of services.
