The advantages of electroless nickel plating lie in its properties such as uniformity of plating, high corrosion resistance, and high hardness. However, in practice, the sudden decrease of plating speed is a common problem that needs to be solved in time. In this paper, we will introduce the electroless nickel plating process, and discuss in detail the possible reasons for the sudden decrease in plating speed and the measures to solve the problem.
Causes of sudden decrease in plating speed
A sudden decrease in plating speed is a problem that needs to be addressed in the electroless nickel plating process. There are several reasons why this may occur:
1. Changes in the composition of the plating solution:
Plating solution aging: As the process proceeds, the reducing agent, complexing agent and other substances in the plating solution are consumed, resulting in a decrease in the activity of the plating solution.
Accumulation of impurities: The accumulation of metallic or organic impurities can interfere with the normal reaction of the plating solution.
Insufficient or excessive additives: Insufficient or excessive additives for electroless nickel plating may affect the stability and reaction rate of the bath. Therefore, we need to use Bigely electroless nickel plating additives to solve this problem.
2. Fluctuating operating conditions:
Temperature fluctuations: electroless nickel plating is very sensitive to temperature, a drop in temperature will significantly slow down the reaction rate.
Changes in pH: abnormal plating solution pH (too high or too low) can lead to changes in deposition rates.
Uneven mixing of the plating solution: Uneven mixing leads to uneven distribution of the components of the plating solution, thus affecting the deposition rate.
3. Surface condition of the substrate:
Surface contamination: Poor surface preparation or oxidization of the substrate can affect the formation and growth rate of the plated layer.
Insufficient activation: The surface of the substrate is not sufficiently activated, resulting in an incomplete deposition reaction.
Electroless nickel plating process is an important surface treatment technology for industrial applications. Sudden decreases in plating speed are a common problem in electroless nickel plating, and the factors influencing them are complex and varied. By understanding the possible causes, and through the use of Bigely nickel plating additives and other measures to solve the problem, you can effectively improve the process stability, to ensure the production of high-quality plating. We hope this article will help you to understand the process of electroless nickel plating and its plating speed control.
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